One new mechanism that is gaining popularity, for example, is a software solution that can trace a device from wafer to die, then to die-on-tape, and then to final product. Additional measurement steps have been added closer to the MOCVD tools that allow excellent correlation between tool settings, recipes and product performance. Some manufacturers also add in-situ metrology, which contributes even more data that can be correlated to product performance. This results in an opportunity to directly impact bin yield by merely adding software along with in-line measurement steps.
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