Alpha to present on die attach technologies for LED assembly at Guangzhou exhibition

May 14, 2015
Somerset, NJ – Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper on die attach technologies for LED assembly at the upcoming Guangzhou International Lighting Exhibition (GILE) taking place June 9th–12th in China.

The paper, titled LED Die Attach Technologies – Trends and Considerations will focus on the key role die-attach materials play in the performance and reliability of mid-power to super-high power LEDs. The presentation will provide an overview of different die attach technology platforms for LED assembly and discuss their key attributes and fit with different chip structures operating at different power levels.

“The selection of the die-attach material for a particular chip structure and application depends on several considerations that include process, reliability, performance and of course cost,” said Gyan Dutt, LED technical marketing manager for Alpha. “I look forward to providing my view on die-attach selection and package assembly process in view of the rapidly increasing adoption of flip-chip on board and chip-on-board (COB) applications.”

During the lighting exhibition, Alpha will exhibit its LED compatible sintered die attach, conductive adhesives and solder assembly bonding materials at Booth # 11.2 B18. Encompassing a comprehensive product line for LED assembly applications, Alpha offers an efficient and reliable solution for every bonding event throughout your assembly process from Die Attach & Package, Package on Board, Luminaire Module, to Power Driver/Supply and Control Systems.

To learn more about Alpha and our LED Technologies, please visit our site.

GILE (Guangzhou International Lighting Exhibition)
Date: June 9-12, 2015
Venue: China Import and Export Fair Complex, Guangzhou, China
Visit Alpha at Booth # 11.2 B18

June 10th, 2015 @ 11:15 a.m. – 12:00 noon
US Pavilion Presentation Area, Hall 11.2 B10
Topic: LED Die Attach Technologies – Trends and Considerations
Speaker: Gyan Dutt, Technical Marketing Manager - LED – Alpha

Speaker Biography – Gyan Dutt
Gyan Dutt works for Alpha as a technical marketing manager for LED Technologies. He is responsible for the planning, organization and implementation of the ALPHA® product portfolio for LED packaging, interconnect and assembly. He has more than 12 years of experience in technical marketing, product development and applications engineering in semiconductor packaging in the US and Asia-Pacific Regions. He co-chairs the iNEMI Solid State Illumination Technology Working Group for the 2015 roadmap cycle and is a member of the SMTA Technical Committee for LED Symposium. Gyan has a MS in Polymer Engineering from the University of Tennessee in Knoxville and a MBA from the University of California in Los Angeles, Anderson School of Management.

About Alpha
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes, cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.

ALPHA, Exactalloy and Argomax are registered trademarks of Alpha Metals, Inc.
Atrox, Maxrel, Fortibond and Lumet are trademarks of Alpha Metals, Inc.


Gyan Dutt - for Alpha