DOE releases cost model for manufacturing of LED packages

Sept. 11, 2012
The DOE has developed a model that allows companies to assess the effect of changing different aspects of their LED manufacturing process flow, for example using different substrates or introducing new manufacturing equipment.
The US Department of Energy (DOE) has released a common cost model for the manufacturing of LED packages.

The Modular LED Cost Model (LEDCOM), which was developed by a DOE working group in response to feedback from previous DOE workshops and roundtables, provides a simplified method for analyzing the manufacturing costs of an LED package.

The model was introduced as part of the newly-revised SSL Manufacturing R&D Roadmap 2012.

The LEDCOM model focuses on the major cost elements of LED manufacturing and includes preliminary raw data and a basic manufacturing process flow. These provide a starting point and can be customized by the user to model different processes, materials, and equipment.

The tool is intended for those involved in the manufacturing of LED packages, from material and equipment suppliers, to epitaxy growers, to wafer processors, to chip manufacturers and packagers.

It will enable these parties to evaluate the relative impact on the final LED package cost of changes made at different points in the manufacturing process.

For example, the tool can be configured to evaluate the impact of changes to the substrate size and type, the fabrication process, raw materials costs, and the manufacturing equipment used.

It can also be used to help complete a cost-benefit analysis in order to quantify the value of a proposed R&D activity by analyzing the impact the anticipated improvements would have on the final LED package cost.

The LEDCOM tool can be downloaded from the DOE SSL website as a zip file that contains the LEDCOM model as an excel worksheet, the backend database, and an operating information document.