|Hymite LED package and wafer|
HyLED technology uses silicon wafers and batch micromachining and metallization processes, delivering package size reductions of up to 4x. Proven IC-style automated manufacturing processes increase throughputs and yields for a lower cost per unit. The option of wafer level assembly and testing could provide major cost benefits for the end customer.
Unlike other package technologies, the micromachined LED cavity acts as a reflector and a thermal conductor, as well as being a reservoir for silicone. Additionally, silicon has excellent inherent thermal management characteristics, and the base of the package is a thin silicon membrane.
Hymite says that a major European customer, which develops and produces high-performance digital light sources, is using the HyLED package and has achieved significant package miniaturization and power efficiencies. LEDs Magazine believes that the customer is Lexedis, which is known to use silicon packaging for its nanoXED emitter (see Lexedis Lighting unveils miniature nanoXED emitter).
“The primary challenge for HB LED manufacturers has been miniaturization and mass production of the components to meet market needs, while addressing unique thermal requirements and reducing the cost per lumen,” said Jochen Kuhmann, CTO and founder, Hymite A/S.
“HyLED silicon packaging overcomes these obstacles through wafer-scale production and assembly. We see a major market opportunity for significant enhancement of HB LEDs for widespread applications and markets.”