ASM Assembly Automation Ltd.

To be the leading integrated system and materials supplier to the global microelectronics industry, ASM offers complete factory automation solutions to customers for their assembly and packaging needs and providing total customer satisfaction with our innovative, cost-effective products. Our solutions cover various packaging markets, including, LED, IC, COB, discrete packages and more...... For LED and Photonics packaging markets, our solutions including wafer scanning, LED dice sorting, map sorting, die bonding (epoxy die bonding, eutectic bonding, TS bonding, flip chip bonding and more..), epoxy curing oven, flux reflow oven, wire bonding (gold ball wire bonding, aluminum wedge bonding), molding and more.. With our commitment of total customer satisfaction, we also provide cost effective and flexible in-line integration (IDEALineT) for your assembly floor linking.