Focus on Fabs & Growth (MAGAZINE)

Feb. 3, 2010
Reflecting the growing level of demand in the LED industry, particularly for backlighting applications, a number of companies are investing in capacity expansions. In some cases, this involves building or acquiring new fabrication facilities, or forming joint ventures and partnerships with other companies.

Osram Opto Semiconductors has announced that its second LED chip-production facility, located in Penang, Malaysia, is now in full operation. Two years after the ground-breaking ceremony in July 2007 (see, the last installation work has been completed and the test phase successfully concluded in what Osram describes as “the world’s most modern LED chip production plant.” The new plant complements the company’s main production facility in Regensburg, Germany, which was expanded in 2008 (see

LED maker Cree Inc. has agreed to purchase a 592,000-sq.ft. facility in Huizhou, Guangdong Province, China, which will be the company’s first chip-production facility outside North America. The new facility will be used to make high-brightness and lighting-class LED chips, although epitaxial wafer growth will not be carried out at the new plant. Chip production is likely to commence in mid-to-late 2010. The new facility will also enable future expansion of components manufacturing.


This article was published in the Jan/Feb 2010 issue of LEDs Magazine. To read the full version of this article, please visit our magazine page, where you can download FREE electronic PDF versions of all issues of LEDs Magazine. You can also request a print copy of LEDs Magazine (available by paid subscription) and sign up for our free weekly email newsletter.