S-910N/S-912N Scalable Dispensing for PCB Assembly and Micro

Jan. 6, 2011
ideal for inline, high-volume applications that do not require heat, such as surface mount adhesive (SMA), silver epoxy, solder paste, and edge- and corner-bonding applications

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.