Key Features
- Exceptionally high thermal conductivity
- High compressive strength
- Superior dimensional stability
- Low thermal expansion coefficient
Master Bond EP30NG is a two component epoxy system for high performance bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures.Part A is a thick paste, Part B is a liquid, and after mixing it retains its paste consistency. The mix ratio is 100 to 15 by weight. Because EP30NG is graphene filled, it is a first rate thermal conductor as well as a low level electrical conductor. It also has very low shrinkage upon curing.
EP30NG bonds well to a variety of substrates including metals, composites, ceramics, glass and many plastics. It has a special nanographene filler that gives it outstanding high compressive strength and enhanced dimensional stability. The service temperature range is -60°F to +300°F. Part A is dark gray and Part B is amber. EP30NG would be considered in applications where high thermal conductivity is a premium and the small amount of electrical conductivity is not a factor.
Product Advantages
- Thick non-drip consistency
- Good physical strength properties
- Reliable adhesive
- Outstanding abrasion resistance
- Excellent heat transfer capabilities
