Oct. 31, 2017
One component, highly electrically conductive, die attach epoxy

Master Bond EP3HTSDA-1 is a fast curing, one part, conductive epoxy system primarily for die attach
applications. It is not premixed and frozen and has an unlimited working life at room temperature. For storage, simple refrigeration is fine. Also, it is very fast curing as noted below. EP3HTSDA-1 dispenses smoothly and easily, without any "tailing." It is well suited for automatic dispensing equipment and can be applied to a defined area without flowing. After curing, it has excellent die shear strength. It has superior dimensional stability and can withstand thermal cycling and shock. The temperature range extends from -80°F to +400°F. It bonds well to metals, ceramics, silicon dies and many other substrates. The thermal conductivity is remarkably high, over 40-45 BTUin/(ft²hr°F) [5.7-6.5 W/(m·k)]. This is substantially higher than other silver conductive epoxies. Also, it passes NASA low outgassing specifications. The extraordinary combination of convenient storage, easy handling and highly desirable properties make this a must go-to material for die attach applications. Actually, its handling and performance properties allow it to be used in many other applications besides die attaching, both in electronic and other high-tech applications where the properties mentioned previously are desirable.

Product Advantages
Single component system; no mixing needed
Not premixed and frozen; unlimited working life at room temperature
Ideal viscosity and flow for die attach
Impressive thermal conductivity
Excellent die shear strength and dimensional stability
NASA low outgassing

Available in syringes that are compatible with automatic dispensing equipment

EP3HTSDA-1 is available is various sizes and units to accommodate customer's needs.

Learn More

Request More Information

By clicking above, I acknowledge and agree to Endeavor Business Media’s Terms of Service and to Endeavor Business Media's use of my contact information to communicate with me about offerings by Endeavor, its brands, affiliates and/or third-party partners, consistent with Endeavor's Privacy Policy. In addition, I understand that my personal information will be shared with any sponsor(s) of the resource, so they can contact me directly about their products or services. Please refer to the privacy policies of such sponsor(s) for more details on how your information will be used by them. You may unsubscribe at any time.