June 17, 2016
Two component, thermally conductive, electrically insulative epoxy system particularly suited for large potting and encapsulation applications

Master Bond EP29LPAO is a two component epoxy system featuring good thermal conductivity along with being electrically isolating. It has convenient handling with a forgiving 100 to 50 mix ratio by weight. It is a lower viscosity material with excellent flow properties. It generates very little heat even when mixing larger masses. Not surprisingly, it has a very long open time as indicated below. EP29LPAO cures at room temperature in 5-7 days or in 6-8 hours at 140-180°F. The best cure schedule is overnight at room temperature followed by 4-5 hours at 150°F. Also noteworthy is its very low shrinkage upon curing, both linearly and volumetrically, as well as its dimensional stability. Its physical strength profile, especially its tensile modulus and compressive strength, is impressive.

This epoxy bonds well to a wide variety of substrates including metals, glass, ceramics and many different plastics. EP29LPAO is a very good heat conductor while retaining reliable electrical insulation values. It is resistant to water, fuels and oils. Part A is off white and Part B is white. The service temperature range is -60°F to +250°F. To summarize, EP29LPAO is best utilized in large encapsulation applications where robust electrical insulation properties and low shrinkage upon curing are critical application requirements. This kind of situation can occur in the aerospace, electronic, electrical and specialty OEM industries.

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