Master Bond EP21AOLV-2LO is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant, coating and encapsulant. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics and many plastics. It has a convenient, one to one mix ratio by weight, a smooth consistency and good flow properties. EP21AOLV-2LO cures readily at room temperature and can be accelerated by heat. The optimum cure schedule is overnight at room temperature followed by 2-4 hours at 150-200°F. Most importantly it has been fully tested and passes ASTM E595 requirements for NASA low outgassing. EP21AOLV-2LO is particularly well suited for potting due to its low exotherm upon curing and highly pourable texture. It resists a wide range of chemicals including water, oils and fuels. The service temperature range for this epoxy is -60°F to +250°F. EP21AOLV-2LO has a low coefficient of thermal expansion and enhanced dimensional stability, along with both a high modulus and compressive strength. The color of Part A is gray; the color of Part B is off-white. This combination of properties makes EP21AOLV-2LO highly desirable to be used in a wide variety of application is particularly in the aerospace, electronic, electro-optical and optical industries where low outgassing, superior thermal conductivity and electrical insulation are critical requirements.
Product Advantages
Convenient handling, one to one mix ratio by weight
Smooth flowing epoxy, ideal for bonding and potting
Low coefficient of expansion, high profile physical strength properties
Top notch thermal conductivity and reliable electrical insulation profile
