Wicop the highest density package
Wicop the highest density package
WICOP (Wafer Level Integrated Chip on PCB) is a totally new concept for an LED product which has overcome the limits posed by the existing CSP (Chip Scale Package) solutions. Seoul Semiconductor succeeded in developing and producing the product for the first time worldwide in 2012. As it is designed to directly connect the chip to PCB, there is no need for packaging processes, such as die bonding or wire bonding. In addition, as there is no intermediate substrate, the size of the chip and package is 100% the same. It is characterized by the super small size and high efficiency. It is also good for the high luminance and thermal conductivity. Seoul Semiconductor were the first to introduce a complete concept of WICOP products in which the size of the package (PKG) is the same as that of chip (Y11,Y15,Y19,Y22,Y22P,Y50), and does not use other costly materials by directly attaching the chip to the PCB. It started to mass produce relevant products and supply them to client companies, thus firmly establishing its position as the leading company in the industry. Also, it secured global patents in respect to WICOP and succeeded in constructing a technological entry barrier.
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