Dow Corning unveils high thermal conductivity silicone adhesive

May 16, 2007
Date Announced: 16 May 2007 Dow Corning Electronics Unveils High Thermal Conductivity, Silver-Filled Silicone Adhesive for Advanced Flip-Chip Semiconductor Devices-- One-Part, Heat-Curable Adhesive Has Been Qualified by Two ChipmakersMidland, Mich. — To address the issue of overheating in advanced flip-chip, ball grid array (FC-BGA) devices, Dow Corning Electronics today unveiled its DOW CORNING® DA-6534 High-Performance Thermal Adhesive. A Dow Corning spokesperson told LEDs Magazine that this material would be a great fit for LED die attach to an MCPCB or other LED substrate.This unique, one-part adhesive combines the proven reliability and flexibility of silicone-based chemistries with a silver filler to achieve high thermal conductivity and elasticity at high and low temperatures, providing long-term reliability for today’s leading-edge semiconductor devices.Achieving thermal resistance of 0.09 cm2 C/W at 24 micron the new adhesive has already been qualified for manufacturing by two major device makers.Silicone-based adhesives act as bonding agents for numerous components throughout the microelectronics industry. As semiconductor devices become more complex and circuitry shrinks, the heat generated from these devices increases significantly. To effectively remove this heat, a high thermally conductive and adaptable thermal interface material (TIM) is needed to perform the dual role of bonding the chip into its package and transferring heat away from the chip toward an integrated heat sink.TIM adhesives must strike a precise balance of physical properties to protect packaged chips from stresses caused by differences in the co-efficients of thermal expansion (CTE) among the chip, package and heat sink. With its novel silicone and silver-based formulation, Dow Corning’s new adhesive surpasses the performance of traditional TIMs on the market today. Other TIMs may require high thermal loading of more than 70 percent filler or use ceramic fillers, both of which can compromise adhesion and thermal reliability. Alternatives such as epoxy-based adhesives offer substandard adhesion and a high modulus, which can lead to cracking or voids that degrade the performance of the packaged chip.As a thixotropic material, DA-6534 offers good dispensability, and its bondline thickness (BLT) can be controlled through pressure and time. In addition, DA-6534 has been designed to be completely inert and not produce any byproducts, which it achieves through the hydrosilylation reaction of vinyl polymers and a hydrogen cross-linker.Dow Corning has a long history of leveraging the unique properties of silicones in thermally conductive formulations, starting with its DOW CORNING® 4 electrical insulating compound introduced in 1944 for cooling magnetos on World War II aircraft. Since then Dow Corning has introduced hundreds of thermally conductive encapsulants and adhesives for the global microelectronics industry.About Dow CorningDow Corning Corporation ( is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technology for all segments of the electronics industry. Dow Corning has development and applications centers strategically located throughout Asia, Europe and the United States. The centers offer advanced resources for electronics materials and services, and are staffed with experienced professionals who can provide technical support to customers locally. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE: DOW) and Corning Incorporated (NYSE: GLW). More than half of Dow Corning Corporation’s sales are outside the United States.

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