JPSA announces 100 mm sapphire wafer dicing for higher LED yields

Date Announced: 11 Apr 2007 J P Sercel Associates announces 100 mm sapphire wafer dicing capability developed with the IX-200 Chromadice™ diode-pumped solid-state (DPSS) UV laser wafer singulation system. The ability to process larger sapphire wafers means higher production yields for LED manufacturers, according to Jeffrey P. Sercel, president.“Our Chromadice™ system can process four (4) 100 mm wafers per hour, compared with the previous 10 2 inch wafers per hour,” Sercel said. “Since each 100 mm wafer has four times as many die as a 2 inch wafer, a typical customer will now be cutting the equivalent of 16 2 inch wafers per hour, per Chromadice™ system. That represents a dramatic increase in yields.”The IX-200 ChromaDice™ DPSS version is a high-precision wafer dicing system also suitable for wafer trimming and scribing applications. Its UV DPSS laser system delivers high-speed wafer dicing and cutting with typical yields more than 99% at less than $2 per wafer. The process is tolerant of wafer warp and bow and suitable for all wafer types. The IX-200 system is also available in an excimer laser version for via drilling, micromachining, thin film patterning and many other semiconductor packaging applications including LED liftoff.New high-accuracy z-theta capable air bearing stages make the larger wafer processing possible, Sercel adds. “The IX-200 easily cuts the larger wafers without impinging on the 20 μm streets.” The integrated z-theta motorized stage boasts non-contact operation – as opposed to typical worm and wheel rotary designs. In addition to offering high precision operation, the new z-theta stage provides 360 ° of rotational capability, and its z-axis capability makes it applicable to a wide range of applications, with the ability to accommodate wafers of varying thicknesses and diameters. Advantages of the rotary stage include continuous or limited travel, excellent accuracy and repeatability, a cog-free motor for smooth motion; zero gear backlash; low wobble and bearing run-out and no accuracy changes over time due to gear wear.The class 1, fully enclosed IX-200 ChromaDice™ is available in 266 or 355 nm UV-DPSS laser wavelengths for a wide range of process capabilities; it can achieve cuts as narrow as 2.5 μm in width, yielding as much as 24% more die per wafer with die yields more than 99%. It delivers excellent results on GaAs, Si and other materials.JPSA products and services include UV excimer, DPSS and ultra-fast laser micromachining systems, UV and VUV laser beam delivery systems, UV laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA operates a high-performance UV laser job shop, as well as a systems engineering and manufacturing business.

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Web Site:www.jpsalaser.com