NuSil Technology introduces low outgassing, thermal interface material

July 28, 2007
Date Announced: 28 Jul 2007 Carpinteria, California - July 27, 2006 - NuSil Technology - a cutting-edge manufacturer of silicone-based materials for healthcare, aerospace, electronics and photonics - has introduced EPM-2493 to its line of electronic packaging materials (EPMs). This low-viscosity, thermal interface material was designed to meet the challenges of the high-temperature and high-stress operating conditions in electronic packaging. The material's low outgassing property is ideal for situations, such as electro-optic systems, in which contamination is a concern. EPM-2493's low viscosity provides users an easy-to-dispense material that flows easily through today's dimensionally intricate electronic configurations. "We launched NuSil's line of electronic packaging materials earlier this year, with a focus on low outgassing materials," said Brian Nash, vice president of Marketing and Sales. "EPM-2493 presents a low-viscosity alternative within our thermal interface material product line."NuSil's line of EPMs was developed to address contamination issues in today's dense electronic systems. Both manufacturing and operating environments can cause drastic temperature cycling, resulting in encapsulant embrittling or outgassing. NuSil's EPMs are designed to perform exceptionally in these situations.About NuSil TechnologyNuSil is a cutting-edge manufacturer of silicone compounds for healthcare, aerospace, electronics, photonics and other applications that require precise, predictable, cost-effective materials performance. ISO-9001-certified since 1994, NuSil operates state-of-the-art laboratories and processing facilities in North America and Europe and provides on-site, in-person application engineering support worldwide. More information about NuSil Technology can be found at

Stephen Bruner NuSil Technology 805-566-4130 x234

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