DSEM metal core substrate with bulk metal thermal conductivity

Mar 19th, 2007
Date Announced: 19 Mar 2007

The traditional Metal Core Printed Circuit Board (MCPCB) or thermal substrate has a dielectric layer between the circuit layer and the metal base for electrical insulation. The dielectric layer has thermal conductivity ranges from 2W/m-k to 12W/m-k. More expensive material like ceramic has about 27W/m-k and AlN at 170W/m-k.

DSEM's latest MCPCB has close to bulk metal thermal conductivity of 200W/m-k at the heat source area and programmable breakdown voltages at the electrical pads. The patented technology allows highly efficient in-plane and through-plane thermal conduction without compromising the electrical breakdown requirement at the electrical circuit areas. The patented metal technology can be a cost effective replacement technology for ceramic base substrate.

DSEM's patented substrate does not use lamination or adhesive; thus, offering superior circuit peel strength at high operating temperature.

Contact
DSEM Systems Technology Sdn. Bhd. Plot 1242, Phase 3, Free Industrial Zone, Bayan Lepas, Penang, 11900, Malaysia Tel: 604-6467311 Fax: 604-6432311

E-mail:kktan@dsem.com

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