Date Announced: 18 Oct 2010 Oxford Instruments Plasma Technology is providing outstanding benefits for HBLED manufacturers, with the launch of the PlasmaPro™ NGP®1000 HBLED range of plasma etch and deposition tools. Unparalleled throughput with industry leading batch sizes from 61 x 2” wafers up to 7 x 6” wafers, coupled with high quality device performance and yield, means that Oxford Instruments is able to provide customers with an exceptional HBLED production offering. The NGP1000 range has been designed to enhance throughput, maximise uptime and reduce cost of ownership through reliable hardware and ease of service. The NGP1000 platform has been optimised for batch production, with a vacuum load lock as standard. Open load and 4-sided cluster options are available. “High Brightness LEDs (HBLEDs) are now an integral part of our lives, providing lighting solutions for a growing number of applications, from backlit televisions to general lighting”, comments Mark Vosloo, Oxford Instruments Plasma Technology Sales Director, “The industry justifiably demands high throughput, device quality and lower cost of ownership, and the NGP1000 offers all these solutions. Oxford Instruments Plasma Technology has been the world leading supplier of high volume batch plasma tools in the production market for over 15 years, with a wide installed base of HBLED production systems. As the industry continues to evolve, we have the technology and expertise to offer the most up to date solutions to our customers.”The PlasmaPro NGP1000 PECVD system is designed for the deposition of SiO2 and SiNx layers, and incorporates a large area electrode and optimised showerhead design, allowing up to 61 x 2”, 15 x 4” or 7 x 6” wafers in a single load. The PlasmaPro NGP1000 etch system, designed for GaN, AlGaInP and Sapphire etch, offers batch sizes up to 55 x 2”, 13 x 4” or 5 x 6”, yielding market leading volumes of wafers/month.Excellent uniformity over large areas is provided by the newly introduced 60MHz Viper™ plasma source. This innovative source achieves comparable plasma densities to ICP sources, maintaining the benefits of high etch rates and low damage. This latest system development reinforces Oxford Instruments’ aim to be the leading provider of new generation tools and systems for industrial and research markets, based on our ability to analyse and manipulate matter at the smallest scale. The company uses innovation to turn smart science into world-class products that support research and industry to address the great challenges of the 21st Century. About Oxford Instruments plcOxford Instruments aims to pursue responsible development and deeper understanding of our world through science and technology. We provide high technology tools and systems for industrial and research markets, based on our ability to analyse and manipulate matter at the smallest scale. Innovation has been the driving force behind Oxford Instruments’ growth and success for over 50 years, and its strategy is to effect the successful commercialisation of these ideas by bringing them to market in a timely and customer-focused fashion. The first technology business to be spun out from Oxford University over fifty years ago, Oxford Instruments is now a global company with over 1,300 staff worldwide and a listing on the London Stock Exchange (OXIG). Our objective is to be a leading supplier of next generation tools and systems for research and industry. This involves the combination of core technologies in areas such as low temperature and high magnetic field environments, Nuclear Magnetic Resonance, X-ray electron and optical based metrology, and advanced growth, deposition and etching. Our products, expertise, and ideas address global issues such as energy, environment, terrorism and health and are part of the next generation of telecommunications, energy products, environmental measures, security devices, drug discovery and medical advances.About Oxford Instruments Plasma TechnologyOxford Instruments Plasma Technology offers flexible, configurable process tools and leading-edge processes for the precise, controllable and repeatable engineering of micro- and nano-structures. Our systems provide process solutions for nanometre layer epitaxial growth of compound semiconductor material, etching of nanometre sized features and the controlled growth of nanostructures. These solutions are based on core technologies in plasma-enhanced deposition and etch, ion-beam deposition and etch, atomic layer deposition and hydride vapour phase epitaxy. Products range from compact stand-alone systems for R&D, through batch tools and up to clustered cassette-to-cassette platforms for high-throughput production processing.
Contact
Susie Williams Marketing Communications Manager Oxford Instruments Plasma Technology e. [email protected] t. +44 (0)1934 837000 f. +44 (0)1934 837001
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Web Site:www.oxford-instruments.com/plasma
