Date Announced: 15 Dec 2010 HACKENSACK, NJ – Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU•in/ft2•hr•ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.EP21ANHT is available in pint, quart, gallon and 5 gallon kits.Master Bond Thermally Conductive Epoxy Systems Master Bond EP21ANHT thermally conductive epoxy system delivers outstanding heat transfer and high temperature resistance.
Contact
CONTACT: James Brenner, Marketing Manager Email: [email protected] Tel: 201-343-8983 Fax: 201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922
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