Thermally conductive epoxy delivers high temperature resistance and outstanding electrical insulation

Dec 15th, 2010
Content Dam Leds En Ugc 2010 12 Thermally Conductive Epoxy Delivers High Temperature Resistance And Outstanding Electrical Insulatio Leftcolumn Article Thumbnailimage File
Date Announced: 15 Dec 2010

HACKENSACK, NJ – Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22 BTU•in/ft2•hr•ºF and serviceability from -60 to 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.

This two component adhesive, sealant, and coating has a convenient 1 to 1 mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18-20 in/in x 10-6/ºC, a dielectric strength of >400 volts/mil, and a tensile shear strength greater than 1,000 psi. It resists a wide range of chemicals and adheres well to a variety of substrates.

EP21ANHT is available in pint, quart, gallon and 5 gallon kits.

Master Bond Thermally Conductive Epoxy Systems

Master Bond EP21ANHT thermally conductive epoxy system delivers outstanding heat transfer and high temperature resistance.

CONTACT: James Brenner, Marketing Manager Email: Tel: 201-343-8983 Fax: 201-343-2132 MASTER BOND INC. 154 Hobart Street Hackensack, NJ 07601-3922


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