Dow Corning announces Dow Corning® OE-8001 die attach adhesive for improved LED manufacturing

June 25, 2010
Date Announced: 25 Jun 2010 Midland, Mich. - Dow Corning’s Electronics group has introduced OE-8001 Die Attach Adhesive, a one-part heat curable methyl silicone resin adhesive for LED (light emitting diode) manufacturing.OE-8001 adhesive excels in areas where competitive materials fall short, offering better adhesion strength than conventional silicone DA and better thermal stability than that of conventional epoxy DA. The new adhesive is formulated for good pin transfer, enabling better application process workability and low viscosity change at room temperature for improved handling. “Dow Corning brand silicone LED materials are designed to meet the challenges of the LED industry, including high adhesion, high purity, moisture resistance, thermal and light stability and optical transmittance,” said Kaz Maruyama, Global Market Manager, Dow Corning Electronics. “Silicones retain optical clarity at elevated temperatures relative to organic materials.”LEDs manufactured using OE-8001 offer good light transmission due to its translucent appearance, and have excellent durability thanks to its high modulus retention over a wide range of temperatures.About Dow CorningDow Corning ( provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services via the company’s Dow Corning® and XIAMETER® brands. Dow Corning is a joint venture equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States.

John Alejandro for Dow Corning.

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