Master Bond develops epoxy with uniquely low thermal expansion properties

Aug. 9, 2006
Date Announced: 09 Aug 2006 Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties as low as 12x10-6 in/in°C as well as unmatched dimensional stability for potting optically sensitive components. The cured material is an excellent electrical insulator and has good thermal conductivity.

Contact
For further information please contact: Sheila Frankel: Phone: +44-207-039-0034 Fax: +44-207-060-0628

E-mail:[email protected]

Web Site:http://www.masterbond.com