Master Bond develops epoxy with uniquely low thermal expansion properties

Content Dam Leds En Ugc 2006 08 Master Bond Develops Epoxy With Uniquely Low Thermal Expansion Properties Leftcolumn Article Thumbnailimage File
13027 1 main Date Announced: 09 Aug 2006

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties as low as 12x10-6 in/in°C as well as unmatched dimensional stability for potting optically sensitive components. The cured material is an excellent electrical insulator and has good thermal conductivity.

For further information please contact: Sheila Frankel: Phone: +44-207-039-0034 Fax: +44-207-060-0628

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