Date Announced: 22 Oct 2009 MH&W International has added new TP-S3LS ultra-low siliconegap fillers to its line of thermal interface materials.TP-S3LS pads contain less than 50 parts per million ofsilicone while providing 3.0 W/mK of themal conductivitybetween hot components and their heat sinks. The gap filler's minimal silicone content makes it suitable for usein silicone-sensitive applications including medicalelectronics, laser optics and telecommunications wheresilicone-based outgassing can lead to contamination andcondensation issues or leave oily residues that interferewith process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured byDongyun Electronics in South Korea.Pads of TP-S3LS material are soft and compliant for easycompression and filling of air gaps between betweenirregular mating surfaces. The material's Shore 00 hardnessis 55. TP-S3LS pads can be used in temperatures up to200°C, which exceeds the use range of silicone-free gapfillers. The material has a UL 94 flame class rating ofV-0. Its dielectric breakdown voltage is more than 5.0 kV. New TP-S3LS gap filler material is available in 210 x 297mm (8.3 in x 11.7 in) sheets or die-cut parts. Standardsheet thicknesses range from 0.5 to 5.0 mm (0.020 in to0.196 in). An optional fiberglass liner is available on 0.5mm (0.020 in) thick pads where added handling strength isneeded. Pricing for standard flat TP-S3LS sheets starts at $0.10per square inch, which is below the cost of other 3.0 W/mKthermal gap fillers now available. Lower priced TP-S3 gapfillers are also available with thermal conductivities of2.0 and 1.0 W/mK. For more information on all TP-S3LS ultra-low silicone gapfiller materials, visit www.mhw-thermal.com, or call201-891-8800.MH&W International provides innovative, customer-focusedthermal management solutions.
Philip Benos MH&W International Corp. Thermal Products Division 14 Leighton Place Mahwah, NJ 07430 Tel: 201-891-8800