Microsolar's LED lamps use copper-aluminum bonding

Jan. 10, 2009
Date Announced: 10 Jan 2009 With the state-of-the-art technology called copper-aluminum bonding, Microsolar's LED lamps are allowed to input over 1.5Amp current into a 40milx40mil single chip with over 250 lm brightness. As you know, the melting point of copper is 1083C; however, the melting point of aluminum is 550C. Therefore, it is extremely difficult to bond the two metals. Without excellent bonding interface of copper and aluminum, the heat can't spread from copper slug into aluminum smoothly. Therefore, the heat of LED chip accumulates within copper. Finally, LED chip fails because of overheat. Microsolar Corp. provides a copper-aluminum bonding Service and products. You are welcome to log on our website to see our products and then you design your aluminum reflector as heat sink. Finally, we bond the LED emitter onto the reflector for you. Once the excellent copper-aluminum interface is done, the LED lamp becomes brighter, cheaper, lighter, life longer, structure simpler, more energy-saving, efficiency higher, etc. We are now also developing 200W LED module for street lamp. With excellent thermal spreading by Copper-Aluminum bonding, the 200 pieces of LED chips can provide over 14000 lm. In the near future, we can see more LED Street Lamps than traditional street Lamps.

Hayashi Wang MicroSolar Corp. 1F, No 22,Kedong 3rd Rd. Hsinchu Science Park, Jhunan, Miaoli 35053, Taiwan, R.O.C. (O) 886 37 587562 (F) 886 37 587563

E-mail:[email protected]

Web Site:www.microsolar.com.tw