Date Announced: 02 Mar 2009 -- The patented technologies for wafer-to-chip singulation addresses mainly the innovative markets for IT, industrial and biomedical laser applications, lighting, data mobility and alternative energy.Grassau (Germany) -- DynTest Technologies GmbH, a manufacturer of scribe and break singulation systems for the opto and electronics industry, expands its activities to Southeast Asia and China. “With Teltec Pacific we have a strong partner and experienced technical sales and service organisation covering Asia Pacific to support our customers in the People Republic of China”, says Helge Luesebrink, Managing Director of DynTest Technologies.“Teltec Pacific has over 23 years’ extensive technical sales & service experience in the Semiconductor, Photonics, LED & Solar Cell industries in the SE Asia Regions. We are proud to represent DynTest and its singulation technology. The DynTest equipment and technologies compliments our existing product portfolio perfectly”, says Judy Chang, General Manager of Teltec Pacific. “All of my colleagues, from 10 different Teltec Pa-cific’s offices in Asia Pacific, are excited about the partnership with DynTest, and we are ready to support the customers with a solution for higher throughput and better quality on wafer dicing by using DynTest’s high quality scribers and breakers."
Contact
Direct contact DynTest Technologies: Helge Luesebrink, Managing Director Phone: +49-8641-6969-20 E-mail: [email protected] DynTest Technologies GmbH, Bahnhofstr. 110 /Gewerbepark Grassau, 83224 Grassau (Germany) Phone: +49-8641-6969-0, Fax: +49-8641-6969-29, E-mail: [email protected] Direct contact Teltec: Judy Chang, General Manager Phone: +852 (252) 14213 E-mail: [email protected] Teltec Semiconductor Pacific Ltd, 2802 Wing On House, 71 Des Voux Road, Central, Hongkong (China) www.teltec.biz
E-mail:[email protected]
Web Site:www.dyntest.de
