Viking Tech develops thin-film metallized substrate for heat dissipation in high-power packaged LEDs

Sept. 18, 2014
Viking Tech uses advanced thin film process technology to develop thermal dissipation for high power LED packages. Our metallized ceramic substrate has excellent thermal dissipation, low thermal expansion coefficient and outstanding stability. Metallized ceramic substrate improves performance and reliability compared to traditional MCPCB substrate.

Features include:
Thin film process technology
Direct plating copper (DPC) process
High trace resolution


Viking Tech America

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