Free Webcast on Thermally Conductive Films & Preforms April 17th, 2008

April 10, 2008
Date Announced: 10 Apr 2008 Ellsworth AdhesivesPresents a FREEE webcast onThermal Conductivity: Films & PreformsThursday, April 17, 2008Time: 2:00 p.m. U.S. EST, 18:00 GMTDuration: Approx 45 minutes with a Q&A session to followTopic: Bond-line Thickness and Integrity in the Importance of Delivering Thermal K- The effects of voids, bubbles, thermal impedance, varying thicknesses on thermal K- Advantages of thermally conductive films and preforms- How films and preforms answer the problems- How to use a film or preform in applications- What TechFilm offers for thermal solutionsSpace is limited to the first 200 registrants.Register Today!Copy and paste the following link into your web browser The Presenter: Phillip Canale, PhD• Techfilm’s Vice President of Technologies • Considered an expert in thermal characterization of polymers by DMA, DSC, TMA and TGA. • Thirteen years experience as a formulator using epoxy, urethane, polyester, acrylate (UV) and silicone chemistries in an applications and formulating environment. • Ph.D. Polymer Science/Plastics Engineering, University of Massachusetts • MS Chemistry/Polymer Science, University of Massachusetts • BS in Plastics Engineering, University of LowellTo learn more about TechFilm products visit: www.techfilm.comSponsored by: Ellsworth Adhesives

Sherrill Retlick, Marketing Manager Ellsworth Adhesives, W129N10825 Washington Dr, Germantown, WI 53022 Phone/Fax: 262-509-8785

E-mail:[email protected]