Thermastrate Presents a Revolution in Thermal Management Technology

July 14, 2008
Date Announced: 14 Jul 2008 • Direct-to-heatsink construction• Best In Class thermal performance• Simple, rugged construction• Versatile and cost effective solutions• Thermal interfaces removed• No TIM or mechanical attachment to heatsink• Reduced material and assembly costs• Suitable for large area LED arraysSupplied as HB LED substrates, heatsink assemblies and completed modules

Tel: +44 (0) 1670 717830 ext 24 Fax: +44 (0) 1670 733452 Email: [email protected] Web:

E-mail:[email protected]