TSSC introduces a cutting-edge substrate for high-power LED

Oct. 28, 2008
Date Announced: 28 Oct 2008 TSSC has successfully introduced ULGA (Ultra thin Land Grid Array) into the high power LED market. With this product LED die can be directly attached on 1.3mm solid copper. ULGA is a PCB type substrate with cavity design and heatsink. This design (cavity) can reduce overall package thickness and allow direct attachment of the die onto the copper(or Al or other metals). ULGA can be widely used in different LED package designs (ex. COB, SMT, single or 2 layers). ULGA is providing great reliability, flexibility (in delivery and design),excellent thermal performance and is very cost competitive. For an exceptional solution on LED, look no further!

Kiki Chin

E-mail:[email protected]

Web Site:www.solutionsystem.com.tw