Namics Corporation and Diemat, Inc. Announce Merger
Namics Corporation and Diemat, Inc. announced today the completion of a merger agreement to combine each company‘s services and products to better serve the global electronics marketplace. The agreement provides new opportunities for customers to benefit from expanded capabilities, complimentary technologies and expanded product lines.
Diemat, founded in 1988, will maintain its brand identity and will continue to operate with the involvement and technical guidance of its founder Ray Dietz who has over 40 years of experience in the electronic materials industry. Mr. Dietz is the holder of over 25 patents. Namics will support the technology, manufacturing and marketing efforts as Diemat continues to grow.
Located in Byfield, Massachusetts, 30 miles north of Boston, Diemat specializes in the development and manufacturing of innovative adhesive and sealing materials to serve the electronic and photonic packaging industry. The company is staffed with professionals having expertise in chemical engineering, polymer chemistry, material science and electronics. The group developed a broad range of unique products that remain unsurpassed in the industry.
Namics Corporation is a leading source for high technology underfills, encapsulants, coatings, specialty adhesives, and insulating and conductive materials for use by the producers of semiconductor devices, passive electronic components and electrical devices. Headquartered in Niigata, Japan with subsidiaries in the USA, Europe, Singapore and China, the company serves its worldwide customers with enabling products for leading edge applications and superior technical support.
For additional sales or product information, visit the Namics Corporation web site at www.namics.co.jp or the Diemat, Inc. web site at www.diemat.com
Raymond Dietz, President, Diemat, Inc., 978-499-0900, firstname.lastname@example.org Toshinobu Odajima, President, Namics Corporation, +81-25-258-5577, email@example.com