T-Global announces release of TG-X 12 W/m-k gap filler

April 22, 2011
Date Announced: 22 Apr 2011 T-Global today announced the release of their new ultra high performance gap filler TG-X.TG-X, which makes an exciting addition to the extensive range of thermal management solutions offered by T-Global, is designed to offer the user the ultimate combination of thermal performance and extreme conformability. TG-X is extremely soft, conformable, cost-effective and offers a best in market thermal performance of 12 W/m-k. In addition to pre-formed thicknesses from 0.5 – 5mm, T-Global also offers custom thicknesses, molded solutions and die cut shapes to meet customer needs. A pressure sensitive adhesive can be added to one or two faces to facilitate production processes.In the high thermal conductivity range TG-X is the softest material commercially available today. The formulation used is low-outgassing, electrically insulating and offers exceptional long term stability. The material is rated UL-VO for flammability and is REACH and ROHS compliant. Typical applications include desktop and laptop computers, consumer and industrial luminaries, consumer and automotive electronics and telecommunication equipment.

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