T-Global Technology releases TGX-2 highly-conformable thermal putty

June 22, 2011
Date Announced: 22 Jun 2011 T-Global Technology is pleased to announce the launch of TGX-2. This is an exceptionally high thermal conductivity putty type material. The material’s unique formulation greatly reduces contact resistance and reduces compression forces placed on delicate components. The material has a low molecular siloxane content, is UL94VO approved and is available as sheet or die cuts. Further information and samples of this product can be obtained from:

Danbury Collins Tel: +44 20 8133 2062

E-mail:[email protected]

Web Site:www.tglobaltechnology.com