Universal Science releases silicon-free UniPhase 3500 thermal interface material

July 19, 2013
Date Announced: 19 Jul 2013 Universal Science, the specialist designer and manufacturer of thermal management materials has introduced a new phase change material that has a thermal conductivity of 3.5 W/mk. This high level of thermal performance coupled with a thin bond line makes UniPhase 3500 ideal for designs where a high degree of heat transfer is required over larger surface areas. UniPhase 3500 provides an ideal replacement for messy and inconsistent thermal grease in applications such as microprocessor / heatsink assemblies, automotive modules and motor drives. The new silicon-free material complements other materials in the UniPhase family that include UniPhase 1000, 2000 and 2500. UniPhase 3500 can be screen printed directly onto a heatsink, typically in a honeycomb pattern and to a recommended maximum thickness of 0.25mm. Unlike thermal grease, UniPhase is dry when applied, this means there is no mess and the heatsink / interface material can be handled and shipped as one. Assembly of the heatsink / interface material with the heat generating component or module is cleaner, faster and easier when using Universal Science’s UniPhase materials versus thermal grease. UniPhase 3500 phase changes the first time it is elevated above 45°C; this is typically when the device coupled to the heatsink, is powered up for the first time. As the material flows, micro air voids are filled and UniPhase 3500 conforms to differing surface textures meaning that heat transfer is maximised. In continuous use the new material has a wide operating temperature range of -40°C to +125°C making it suitable for use in applications in challenging environments with high ambient temperatures.

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