Advantek installs tape forming equipment to support advanced chip-scale packaging for LED industry

Oct. 10, 2013
Date Announced: 10 Oct 2013 The LED industry’s accelerating adoption of advanced packaging solutions is driving the demand for very high precision carrier tape. To support this growing need, Advantek has expanded capacity by installing new state-of-the-art tape forming machines at all three of their manufacturing facilities; China, Taiwan and the Philippines. These precision machines produce carrier tape with the accuracy and quality required for these emerging technologies and bare die.The continued pressure on the LED manufactures to reduce costs and improve luminosity has them spending significant R&D resources on the development of innovative packaging solutions. There are many approaches being pursued throughout the industry; such as Chip Scale Packaging (CSP), variants of flip chip, Package Free Chip (PFC), Embedded LED Chip (ELC), etc. Recent product news from Philips, Cree, OSRAM, Toshiba, Epistar, and Formosa to name a few, highlight the rapid development of these technologies. It is imperative these ultra small LEDs are protected from damage during transportation and storage; and presented accurately to high-speed pick and place machines during production. The use of very precise pockets formed in high quality materials is essential. Using the right carrier tape solution will help ensure today’s automated manufacturing processes can smoothly handle these very small LEDs.Advantek, Inc., a global leader in delivering advanced carrier tape solutions to the world's LED and semiconductor manufacturers. Providing a broad range of precision packaging components including embossed carrier tapes (PS & PC), anti-static cover tapes, shipping reels, static shielding / moisture barrier bags, desiccants, and other packaging products. Advantek, an ISO 9001:2000 and ISO 14001 certified company, has facilities throughout Asia, North America, and Europe.

Tim Hemken - Director of LED Packaging

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