SUSS MicroTec introduces BlueRay semiautomatic probe system

Content Dam Leds En Ugc 2005 08 Suss Microtec Introduces Blueray Semiautomatic Probe System Leftcolumn Article Thumbnailimage File
Date Announced: 01 Aug 2005

MUNICH, Germany – SUSS MicroTec AG has introduced the BlueRay semiautomatic wafer probe system, setting a new standard in z-axis accuracy and communication for high speed testing.

Optoelectronic devices, such as LEDs, are becoming widespread in everyday applications. This means that testing the numerous devices on each wafer needs to be done quickly and effectively. In order to achieve cost-effective production, manufacturers use the bonding pads as testing pads. If these pads are damaged, then the entire device is unusable. Additionally, if a device is not contacted by the probes, then potentially bad dies could be packaged – also a costly error.

With the BlueRay’s z-axis accuracy, it is now possible to be fully confident in test results from both wafers and substrates. The BlueRay’s precision guarantees a safe, repeatable electric contact with the device under test (DUT), which reduces pad damage and eliminates probe mark inspections. The communication between the prober and the controller is also optimized to provide a fast cycle time, which is critical in high throughput testing. Of course, the probe system is also semiautomatic, allowing manufacturers to automate test processes.

“We are proud to have the reputation as the market leader in precision,” states Frank-Michael Werner, Optoelectronics Product Manager at SUSS. “That being said, we saw a substantial need in the market for a probe system capable of combining high precision with high speed. We are pleased to say that the BlueRay does both.”

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders and probe systems. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. SUSS MicroTec AG is listed in the Tec-DAX segment of the German Stock Exchange.

Contact
Joshua M. Preston MarCom Specialist SUSS MicroTec Tel: +49 (0) 35240 73 349

E-mail:jpreston@sussdd.de

Web Site:http://www.suss.com

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