3M's innovative design delivers LED requirements as well as cost savings in materials and future reel-to-reel manufacturing opportunities
AUSTIN, Texas -- 3M Electronics Materials Solutions Division announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 3M’s substrate in reel format will help the industry’s evolution to reel-to-reel manufacturing which should result in lower manufacturing cost. This innovative chip packaging substrate will be available to view at Lightfair International, June 3-5, 2014 in Las Vegas, NV at the 3M booth (# 4821).
Contact:
Jeanine Brooks - 3M
+1-512-984-2146
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