BrightSpots LED Forum focuses on LED manufacturing, cost and performance

Oct. 4, 2010
A panel of industry experts will investigate LED design and manufacturing issues during a two-week online panel discussion beginning October 4th.
For two weeks in early October, the BrightSpots LED Forum online panel discussion will enable industry professionals to partake in an active discussion exploring the key issues surrounding HB-LEDs, from design to manufacturing.

The BrightSpots LED Forum offers a platform for continuous dialogue that extends the life of a traditional panel event. Running October 4-15, 2010, the BrightSpots LED Forum will feature a lineup of industry experts exploring critical issues associated with HB-LED technology.

Anyone with an interest in LED manufacturing and design can join the Forum and contribute to the discussion.

Moderating the forum will be Tim Whitaker, editor-in-Chief and founder of LEDs Magazine. Panelists include industry leaders from throughout the HB-LED value chain:

  • David Bour, Chief Technologist, LED Product Technology, Applied Materials
  • Thomas Uhrmann, Business Development Manager, Compound Semiconductors and Si-based Power Devices, EV Group
  • John Wilson, Consulting Engineering Manager, WRO, Mechanical Analysis Division, Mentor Graphics
  • Willem Sillevis Smitt, Director of Strategic Marketing, Philips Lumileds
  • Doug Anberg, Vice President, Advanced Stepper Technology, Ultratech
The forum is hosted by MCA, a global high-tech communications agency, in cooperation with SemiNeedle.

Among the questions already posted are:

  • LED cost: What are the key drivers that will allow the continued reduction in the cost of light (dollars per lumen)?
  • What can be done to improve customer satisfaction with regard to binning and color consistency?
  • The LED industry shows major differences from the mature silicon IC and MEMS industries. How far can mature process technologies from these areas be transferred to the LED industry?
  • What are benefits and hurdles of silicon-based wafer-level packaging of LEDs?
  • Will the industry eventually shift to epitaxy on silicon wafers? What are the benefits and hurdles?
We look forward to your active participation in the BrightSpots LED Forum in the next two weeks.