Bergquist introduces Bond-Ply TCP-1000 thermal material
A new material combines better thermal performance than FR-4 with ease of processing.
The new material is specifically intended as a high performance alternative to FR-4 and offers 3.5x better thermal performance, allowing for performance levels needed to increase lumens per watt output while effectively managing LED device temperature.
Bond-Ply TCP-1000 features a panel lamination process similar to traditional FR-4 epoxy glass. Laminated panels are available in various thicknesses depending on the base metal and circuit foil thickness. The standard sheet size is 18 x 24 inches.