|Lednium high-power package|
The products are assembled by mounted chips into cups then placing the cups into a dome-shaped leadframe. Lednium's unique architecture is repeatable in mass production, and can accept all chip architectures, which means it can benefit from future advances in chip technology.
LEDs Magazine spoke with John Montagnat, senior development engineer with Lednium, to discuss details of the company's novel packaging approach.
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