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Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. It is easily cured at elevated temperatures as low as 250°F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and straightforward; 20-30 minutes at 250°F or 10-15 minute at 300°F. EP3UF-1 is distinguished by being thermally conductive and electrically insulative by using very special filler material with ultra small particle sizes. These granules allow EP3UF-1 to be used as an underfill in spaces as small as 10-15 microns wide. As an underfill system, EP3UF-1 has high mechanical strength properties, outstanding dimensional stability and low shrinkage upon curing.

EP3UF-1 also is a highly useful thermally conductive adhesive. Since the filler is thermally conductive and the particle size very small, as mentioned above, it can be applied in thin bond lines of 10-15 microns. This, in effect, lowers the thermal resistance and effectively increases the heat transfer properties of the system. For example, with a typical thermally conductive filler, a reasonable bond line thickness is about 50 microns. With this epoxy, the thermal resistance would be 30-50 x 10-6 Km2/W. However, when an epoxy such as EP3UF-1 is applied in thickeness of 10-15 microns, the thermal resistance drops to 5-7 x 10-6 Km2/W. Obviously, this is helpful in managing heat related issues. Some other noteworthy attributes of this system include the ability to bond well to a variety of substrates such as metals, composites, ceramics and many plastics. It has reasonably good resistance to a wide variety of waters, oils and fuels. The color of EP3UF-1 is light yellow. The service temperature range is -60°F to +250°F. EP3UF-1 is a highly effective thermal interface material for bonding and underfill applications in microelectronic packaging and assembly.

Product Advantages
One component; no mixing; not premixed and frozen
Unlimited working life at room temperature
Exceptional flow properties
Rapid curing with versatile cure schedules
Can be used as an underfill for very tight spaces
Small particle size lowers thermal resistance
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