Date: October 28, 2013
Time: 3:00 PM EDT / 2:00 PM CDT / 12:00 PM PDT / 7:00 PM GMT
Presenter: Garry Wexler, field applications engineer, Thermal Substrates Division, The Bergquist Company
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Overview:
Utilizing high power LEDs in commercial lighting applications has increased dramatically over the past few years. Smaller form factors, increased power densities and lower thermal resistance packages have advanced to the point where the need for good thermal management solutions is absolutely necessary to assure consistent system performance and long-term reliability. Good thermal management of LED lighting applications requires an understanding of the following key topics:
- Understanding the LED's thermal performance as it relates to package style, footprint geometry and thermal resistance can help in selecting the most appropriate thermal solution.
- MCPCB material stack-up selection can be tailored to meet the requirements of a particular application.
- Circuit design can be optimized to maximize heat spreading.
- Circuit part geometry can be designed to optimize material utilization with lowest total cost in mind.
- Thermal interface material selection can be made best by understanding the interface surface geometries between the MCPCB and the heat sink to achieve the thermal and mechanical performance required.
Clarification of options available for standard metal base circuits and circuit designs that can maximize thermal performance will be provided. Identification of various types of thermal interface materials commonly used in lighting system designs will be discussed. Specific ways to address designs with lowest total cost in mind will also be included.
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SPONSOR
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Innovation, performance and customer satisfaction are Bergquist's guiding principles. Today, Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. For more information, visit www.bergquistcompany.com.
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SPEAKER
Garry Wexler is currently a field applications engineer for The Bergquist Company. He is working on a number of innovative products and processes required to solve various industry driven thermal management challenges. Garry has worked for The Bergquist Company for 14 years in a number of engineering and technical sales roles. He received his bachelor's degree in Chemical Engineering from the University of Minnesota in 1999.
