Taconic offers Tac-LED IMS substrate also with copper backing

Date Announced: 13 Sep 2010

IMS (Insulated Metal Substrate) base materials are a cost-effective solution for higher thermal dissipation of printed circuit boards. Applications are high power LEDs, cooling of transistorsm control units and power units.

Metal core pcbs use aluminium clad dielectric substrate materials instead of universally used copper foil clad laminates. Taconic Tac-LED-10 (thermal conductivity 1 W/mK) and Tac-Led-20 (thermal conductivity 2 W/mK) are used globally for these types of printed circuit boards.

Continuous developments in Photovoltaic, in particular for CPV, don't just require base materials of high thermal conductivity, and require this also for the metal backing. Since many years Taconic manufactures RF base materials with heavy copper backing and can now offer IMS base materials using the same manufacturing technology. Typical copper thickness of copper backing is 0.5 mm (20 mil)

Characteristic Tac-LED-10 Tac-LED-20 Unit
Thermal Conductivity 1,0 2,0 W/mK
Dielectric Thickness 0,085 0,085 mm
Thermal Impedance 0,13 0,6 °C*in2/W
Dielectric Breakdown >6 >6 kV
Solder Resistance
(300 Deg C) >10 >10 min
Flammability V-0 V-0 UL-94
Copper Peel Strength
(1 oz) 1,7 1,5 N/mm

Aluminium Copper
Thermal Conductivity 180 390 W/mK

Typical Base material coding for thick copper cladding: TacLED-20-C2/CU0.5mm.

Manfred Huschka, VP Global Sales Taconic Advanced Dielectric Division Mullingar, Co. Westmeath Ireland


Web Site:www.taconic-add.com

More in Company Newsfeed