Palomar announces high-accuracy processes for RF, optoelectronics & automotive microelectronics assembly

Content Dam Leds En Ugc 2012 09 Palomar Announces High Accuracy Processes For Rf Optoelectronics Automotive Microelectronics Assembl Leftcolumn Article Thumbnailimage File
36495 0 thumb Date Announced: 07 Sep 2012

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at http://www.imaps.org/programs/IMAPS2012.pdf.

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at http://www.imaps.org/webcasts/2012may_palomar.htm

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at http://www.palomartechnologies.com/contact-us.

Contact
Jessica Sylvester Marketing Communications, Palomar Technologies

E-mail:jsylvester@bonders.com

Web Site:www.palomartechnologies.com

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