Palomar announces high-accuracy processes for RF, optoelectronics & automotive microelectronics assembly

Content Dam Leds En Ugc 2012 09 Palomar Announces High Accuracy Processes For Rf Optoelectronics Automotive Microelectronics Assembl Leftcolumn Article Thumbnailimage File
36495 0 thumb Date Announced: 07 Sep 2012

Palomar Technologies, the world-leading provider of precision microelectronics and optoelectronic packaging systems, today announced that lead engineers will be presenting three highly technical talks at the IMAPS 2012 conference, held September 11-13 at the San Diego Town & Country Convention Center. Palomar Technologies will exhibit in booth #322.

1. High-Reliability Component Attachment Process for <5μm Placement Accuracy
Speaker: Donald J. Beck

2. Mixed Attachment Technology Studies in RF & Optoelectronic Packages Requiring High-Accuracy Placement

Speaker: Daniel D. Evans, Jr.

3. Gold Ball Wire Bonding with Heated Tool for Automotive Microelectronics
Speaker: David J Rasmussen

The complete IMAPS session agenda is available online at

Palomar Technologies has also collaborated with IMAPS to host an on-demand webcast on "High-Reliability Component Attachment Process for <5um Placement Accuracy". Palomar Technologies Assembly Services general manager originally presented the webcast live in mid-June. The complimentary webcast recording is available at

Palomar Technologies is accepting meeting requests throughout the duration of IMAPS 2012. Requests may be submitted online at

Jessica Sylvester Marketing Communications, Palomar Technologies


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