Toshiba's ultrasmall CSP white LEDs achieve luminous efficacy of 130 lm/W
TOKYO--Toshiba Corporation (TOKYO:6502) has announced the launch of ultra-small chip scale package (CSP) white LEDs for lighting applications that can reduce the mounting area by 90% compared to conventional 3.0 x 1.4 mm package products.  The new “TL1WK series” will start sample shipment from April.
The new products utilize gallium nitride-on-silicon (GaN-on-Si) process technology and a new process technology that fabricates the elements of a packaged LED on an 8-inch silicon wafer. The LEDs are the industry’s smallest in sub-watt class (1/4-1/2W) white LEDs, with a package size of just 0.65 x 0.65mm, but they achieve a luminous efficacy of 130lm/W and superior heat dissipation. Using the new white LEDs makes it possible to achieve a narrow beam in small-size lighting equipments and can contribute to innovation in lighting design.
The new white LEDs will be showcased at “Light+Building”, a trade fair for lighting and architecture in Frankfurt, Germany from March 30 to April 4.
Light sources for general lighting, including straight tube lights, light bulbs and ceiling lights
Main Specifications of the New Products
|Series Name||TL1WK Series|
|Package Size||0.65 x 0.65 mm (Typ.)|
|Color Rendering Index|
|Forward Current||180mA (Max)|
|Luminous Efficacy||130lm/W (Typ.)|
|Others||Color variations under planning|
(4000K, 3000K, 2700K)
 Toshiba survey.
 As of March 27, 2014. Toshiba survey.
 During 60mA operation. Toshiba survey.
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Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.
Toshiba is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances.
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