TSSC introduces a cutting-edge substrate for high-power LED

Content Dam Leds En Ugc 2008 10 Tssc Introduces A Cutting Edge Substrate For High Power Led Leftcolumn Article Thumbnailimage File
17122 0 thumb Date Announced: 28 Oct 2008

TSSC has successfully introduced ULGA (Ultra thin Land Grid Array) into the high power LED market.

With this product LED die can be directly attached on 1.3mm solid copper. ULGA is a PCB type substrate with cavity design and heatsink. This design (cavity) can reduce overall package thickness and allow direct attachment of the die onto the copper(or Al or other metals).

ULGA can be widely used in different LED package designs (ex. COB, SMT, single or 2 layers).

ULGA is providing great reliability, flexibility (in delivery and design),excellent thermal performance and is very cost competitive. For an exceptional solution on LED, look no further!

Contact
Kiki Chin

E-mail:kiki.chin@solutionsystem.com.tw

Web Site:www.solutionsystem.com.tw

More in Company Newsfeed