T-Global Technology releases TGX-2 highly-conformable thermal putty

Date Announced: 22 Jun 2011

T-Global Technology is pleased to announce the launch of TGX-2. This is an exceptionally high thermal conductivity putty type material. The material’s unique formulation greatly reduces contact resistance and reduces compression forces placed on delicate components. The material has a low molecular siloxane content, is UL94VO approved and is available as sheet or die cuts.

Further information and samples of this product can be obtained from:



Contact
Danbury Collins Tel: +44 20 8133 2062

E-mail:sales@tglobaltechnology.com

Web Site:www.tglobaltechnology.com

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