BPA releases metal-core PCB research

Date Announced: 20 Mar 2013

POWER ICs & LEDs – A NEW GENERATION OF SOLID STATE ELECTRONICS IS GIVING RISE TO A NEW GENERATION OF PCBs

Driven by new generations of power semiconductors packaged as surface mount devices, the role of the circuit board is moving beyond mounting and interconnection towards actuation – towards making things happen.

The combination of power and intelligence made possible by the digitalization of power supply, conversion, and control is becoming an enabling factor for a rapidly expanding range of opportunities – some that are already here and many that are completely new. At the same time semiconductor technology is opening up an entirely new field of application: Solid State Lighting. High Brightness LEDs are set to drive fundamental changes in the way lighting is designed and used.

In their just-released report "Metal In the Board- Opportunities for Printed Circuit Boards Providing Enhanced Thermal and Power Management" - BPA Consulting provide a unique window on this rapidly developing opportunity for new classes of substrates which BPA have defined as “MiB”. Circuit boards which support power densities of over 20W/cm2 and currents as high as 1000 Amperes while at the same time providing printed circuit capabilities from simple, single layer circuits to complex HDI multilayers using low loss dielectrics.

The report authors have built on years of manufacturing experience to create a “bottom-up” analysis from applications teardowns and operating requirements, identifying and profiling a number of board level solutions for the management of heat and power.

The Report then moves up through the value chain, looking at the primary applications, identifying the MiB solution best aligned with each, and quantifying the relative market opportunities.

Board shipments incorporating MiB are expected to grow from $1.6 billion in 2012 to close to $4 billion in 2020 enjoying an average growth rate of approx. 12% per year with some types exceeding 60% pa. At the same time the Report identifies hidden traps and opportunities generated by the confluence of technological and market trends.

The Report provides several analytical frameworks, including global and applications-specific forecasts by Type, Application, and Region out to 2020, as well as business analysis including roadmaps, opportunities, and threats. This report is a must-have for business planning throughout the board level value chain, providing an invaluable aid for capacity/capability roadmapping and planning.

For the full profile of opportunity and lots more explanation, please visit www.bpaconsulting.info/bpainfo-mib-profile-mar13.html – or contact Nick Pearne (n.pearne@bpaconsulting.com) or Bill Burr (w.burr@bpaconsulting.com) with comments or for further information.

Contact
BPA Consulting Ltd Dorset House Regent Park 297 Kingston Road Leatherhead Surrey KT22 7PL United Kingdom Tel: +44 1306 875500 Fax: +44 1737 231557

E-mail:c.smith@bpaconsulting.com

Web Site:www.bpaconsulting.com

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