SUSS introduces new LED wafer-level bonding technology

Sep 27th, 2005
Date Announced: 27 Sep 2005

Reduces Cost, Increases Throughput up to 8X

MUNICH, Germany--SUSS MicroTec AG (FWB:SMH)(GER:SMH) introduces their new patent pending technology that performs simultaneous bonding of wafers, including eutectic processes to achieve impressive cost reduction while increasing throughput up to 8X. SUSS' new high throughput LED bonder has been accepted worldwide for applications including bonding of HIGH POWER and HIGH BRIGHTNESS LEDs.

The leading producers of HIGH BRIGHTNESS and HIGH POWER LEDs require cost reduction solutions. The SUSS LED bonder has been proven in production to be a cost reducing, yield improving, equipment set.

"SUSS is dedicated to providing our customers with the best possible equipment. The design and marketing of the SB8eLED bonder is an indication of our commitment and leadership in proving wafer bonding solutions that do just that" said Mike Kipp, Wafer Bonder Division Manager.

Additionally this is the ideal equipment solution for the simultaneous temporary bonding of wafers to a carrier for subsequent WAFER THINNING.

High brightness LEDs are capable of matching conventional lighting, are smaller and longer lasting, are low in power consumption, and have a low thermal output. All of which helps our environment. SUSS is proud to play a role in this with our exciting new technology.

With its superior temperature and uniformity, precision bond tooling, and newly designed high alignment chamber, the SB8eLED bonder will surely be utilized in the production of other innovative products.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, substrate bonders, flip-chip bonders, probe systems and now equipment for C4NP production.

Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.

Contact
SUSS MicroTec AG Fiona Kemp, +49 (0)89 32007 395

E-mail:f.kemp@suss.de

Web Site:http://www.suss.com

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