Dimensions of Cree's InGaN-on-SiC LED chips relative to the standard GaN device. RazerThin (RT) devices are only 95 microns thick. MegaBright (MB) chips are shaped to improve light extraction. XBright (XB) chips are mounted junction side down for improved heat extraction. XThin (XT) devices are also shaped and much thinner, for backlighting applications. Credit: Cree