LED Design & Manufacturing 

Sapphire, silicon-carbide, gallium-nitride (GaN) and silicon wafers to MOCVD tools for GaN epitaxial active-layer growth and back-end processing and packaging technologies deliver efficient LED emitters.

Products

Future Facilities 6SigmaET Release 9 thermal-analysis simulation software reduces electronics development time

Future Facilities 6SigmaET Release 9 thermal-analysis simulation software red...

Intertronics' BlueWave UV-LED flood system provides fast curing in manufacturing applications

Intertronics' BlueWave UV-LED flood system provides fast curing in manufactur...

Morgan Advanced Materials' wear-resistant films extend life of electrostatic chucks used in electronics manufacturing

Morgan Advanced Materials' wear-resistant films extend life of electrostatic ...

Gigahertz-Optik's spectral light and color meter enables synchronized LED binning

Gigahertz-Optik's spectral light and color meter enables synchronized LED bin...

Excelitas Technologies unveils new UV-LED curing systems for commercial, industrial, and medical applications

Excelitas Technologies unveils new UV-LED curing systems for commercial, indu...

Veeco's EPIK700 MOCVD system achieves high yields and productivity to lower LED manufacturing costs

Veeco's EPIK700 MOCVD system achieves high yields and productivity to lower L...

Viking Tech develops thin-film metallized substrate for heat dissipation in high-power packaged LEDs

Viking Tech develops thin-film metallized substrate for heat dissipation in h...

Alta LED announces High Power 4s horticultural LED light source

Alta LED announces High Power 4s horticultural LED light source

GL Optic integrating sphere allows for precise measurement of large LED modules

GL Optic integrating sphere allows for precise measurement of large LED modules

Ellsworth Adhesives offers Dymax BlueWave LED Flood System for light-curing of adhesives

Ellsworth Adhesives offers Dymax BlueWave LED Flood System for light-curing o...

Round and flat profile heat pipes from ATS cool hot electronic components

Round and flat profile heat pipes from ATS cool hot electronic components

Northfield Automation introduces rapid roll-to-roll systems for test and inspection of flexible electronics such as displays

Northfield Automation introduces rapid roll-to-roll systems for test and insp...

Master Bond two-part epoxy for electronics is resistant to harsh chemicals and temperature extremes

Master Bond two-part epoxy for electronics is resistant to harsh chemicals an...

Promation introduces 48-in. long LED PCB handling systems

Promation introduces 48-in. long LED PCB handling systems

DELO adhesive offers low-stress curing for temperature-sensitive LEDs

DELO adhesive offers low-stress curing for temperature-sensitive LEDs

MicroSense develops automated metrology system that measures sapphire LED wafers with any surface finish

MicroSense develops automated metrology system that measures sapphire LED waf...

MaxMile Technologies' EpiEL system tests LED wafers up to 12 inches in production line

MaxMile Technologies' EpiEL system tests LED wafers up to 12 inches in produc...

3M's new LED chip packaging substrate offers cost-effective alternative to ceramic

3M's new LED chip packaging substrate offers cost-effective alternative to ce...

Forge Europa designs custom optics for LED lighting or assembly with LED PCBs

Forge Europa designs custom optics for LED lighting or assembly with LED PCBs

Soraa will debut large GaN-on-GaN LED lamps at LightFair

Soraa will debut large GaN-on-GaN LED lamps at LightFair

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