LED Design & Manufacturing 

Sapphire, silicon-carbide, gallium-nitride (GaN) and silicon wafers to MOCVD tools for GaN epitaxial active-layer growth and back-end processing and packaging technologies deliver efficient LED emitters.

Products

Viking Tech develops thin-film metallized substrate for heat dissipation in high-power packaged LEDs

Viking Tech develops thin-film metallized substrate for heat dissipation in h...

Alta LED announces High Power 4s horticultural LED light source

Alta LED announces High Power 4s horticultural LED light source

GL Optic integrating sphere allows for precise measurement of large LED modules

GL Optic integrating sphere allows for precise measurement of large LED modules

Ellsworth Adhesives offers Dymax BlueWave LED Flood System for light-curing of adhesives

Ellsworth Adhesives offers Dymax BlueWave LED Flood System for light-curing o...

Round and flat profile heat pipes from ATS cool hot electronic components

Round and flat profile heat pipes from ATS cool hot electronic components

Northfield Automation introduces rapid roll-to-roll systems for test and inspection of flexible electronics such as displays

Northfield Automation introduces rapid roll-to-roll systems for test and insp...

Master Bond two-part epoxy for electronics is resistant to harsh chemicals and temperature extremes

Master Bond two-part epoxy for electronics is resistant to harsh chemicals an...

Promation introduces 48-in. long LED PCB handling systems

Promation introduces 48-in. long LED PCB handling systems

DELO adhesive offers low-stress curing for temperature-sensitive LEDs

DELO adhesive offers low-stress curing for temperature-sensitive LEDs

MicroSense develops automated metrology system that measures sapphire LED wafers with any surface finish

MicroSense develops automated metrology system that measures sapphire LED waf...

MaxMile Technologies' EpiEL system tests LED wafers up to 12 inches in production line

MaxMile Technologies' EpiEL system tests LED wafers up to 12 inches in produc...

3M's new LED chip packaging substrate offers cost-effective alternative to ceramic

3M's new LED chip packaging substrate offers cost-effective alternative to ce...

Forge Europa designs custom optics for LED lighting or assembly with LED PCBs

Forge Europa designs custom optics for LED lighting or assembly with LED PCBs

Soraa will debut large GaN-on-GaN LED lamps at LightFair

Soraa will debut large GaN-on-GaN LED lamps at LightFair

OPTIS launches virtual prototyping software for design of automotive LED headlamps

OPTIS launches virtual prototyping software for design of automotive LED head...

Toshiba's ultrasmall CSP white LEDs achieve luminous efficacy of 130 lm/W

Toshiba's ultrasmall CSP white LEDs achieve luminous efficacy of 130 lm/W

AIT's COOL-PAD CPR7154 thermal interface material combines compressibility, comformability, and phase-change ability

AIT's COOL-PAD CPR7154 thermal interface material combines compressibility, c...

Lambda Research improves TracePro illumination and optical design software with photorealistic rendering

Lambda Research improves TracePro illumination and optical design software wi...

Arima Optoelectronics releases molybdenum-substrate LED die

Arima Optoelectronics releases molybdenum-substrate LED die

InfiniLED demonstrator board includes microLED designs, reference standard LED for product development

InfiniLED demonstrator board includes microLED designs, reference standard LE...

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