Two-part, liquid dispensed thermal epoxy provides exceptional bonding strength for LED lighting, power supplies and discrete component applications.
Chanhassen, MN -- The Bergquist Company is proud to introduce its latest product in our Liqui-Bond® family – Liqui-Bond® EA 1805. Sporting a Thermal Conductivity of 1.8 W/m-K, our new Liqui-Bond® EA 1805 is a two-component, epoxy based, liquid dispensable adhesive that cures at room temperature with a high bond strength that can be accelerated with additional heat. Having a high bond strength eliminates the need for fasteners and maintains a structural bond even in severe environments. Liqui-Bond® EA 1805 is thixotropic, remaining in place during dispensing and flows easily under minimal pressure. With a minimum bondline it delivers very low stress on fragile components during assembly. Liqui-Bond® EA 1805 is ideal for filling surface irregularities between heat sources and heat spreaders of surfaces with similar CTE. LED lighting, power supplies, discrete component to heat spreader and PCBA to housing applications are appropriate uses for Liqui-Bond® EA 1805.
Contact:
Janna Flemmer - The Bergquist Company
+1-952-820-6507
Web site:
www.bergquistcompany.com
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