|
|
|
| < Previous | Next > | Category listing | Browse and search categories | |
|
| | Detailed Description Diamond abrasive slurries for back-side thinning of LED wafers. Sales and representatives in Europe, Asia and the US. | | Categories | Chip Design & Manufacturing
- Chip processing equipment
- Wafers & substrates (sapphire, SiC, GaAs, AlN, ZnO etc) | | |
